HD6472246FA
vs
HD6472246FA
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
RENESAS ELECTRONICS CORP
|
HITACHI LTD
|
| Part Package Code |
QFP
|
QFP
|
| Package Description |
14 X 14 MM, 0.50 MM PITCH, PLASTIC, QFP-100
|
FQFP, QFP100,.63SQ,20
|
| Pin Count |
100
|
100
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Has ADC |
YES
|
|
| Additional Feature |
ALSO OPERATES AT 2.7V MINIMUM SUPPLY AT 10MHZ
|
|
| Address Bus Width |
24
|
|
| Bit Size |
16
|
16
|
| Clock Frequency-Max |
20 MHz
|
|
| DAC Channels |
NO
|
|
| DMA Channels |
NO
|
|
| External Data Bus Width |
16
|
|
| JESD-30 Code |
S-PQFP-G100
|
S-PQFP-G100
|
| JESD-609 Code |
e0
|
|
| Length |
14 mm
|
14 mm
|
| Number of I/O Lines |
79
|
|
| Number of Terminals |
100
|
100
|
| Operating Temperature-Max |
75 °C
|
70 °C
|
| Operating Temperature-Min |
-20 °C
|
-20 °C
|
| PWM Channels |
YES
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
FQFP
|
FQFP
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, FINE PITCH
|
FLATPACK, FINE PITCH
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| ROM Programmability |
OTPROM
|
UVPROM
|
| Seated Height-Max |
3.05 mm
|
3.05 mm
|
| Speed |
20 MHz
|
13 MHz
|
| Supply Voltage-Max |
5.5 V
|
|
| Supply Voltage-Min |
4.5 V
|
|
| Supply Voltage-Nom |
5 V
|
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL EXTENDED
|
COMMERCIAL
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
14 mm
|
14 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
| Base Number Matches |
1
|
1
|
| CPU Family |
|
H8S/2000
|
| Package Equivalence Code |
|
QFP100,.63SQ,20
|
| RAM (bytes) |
|
8192
|
| ROM (words) |
|
65536
|
| Supply Current-Max |
|
52 mA
|
|
|
|