HD6433060TE
vs
HD6433060TE
feature comparison
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
RENESAS ELECTRONICS CORP
|
HITACHI LTD
|
| Package Description |
FQFP,
|
TFQFP,
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Has ADC |
YES
|
YES
|
| Address Bus Width |
24
|
24
|
| Bit Size |
32
|
32
|
| Clock Frequency-Max |
20 MHz
|
20 MHz
|
| DMA Channels |
NO
|
YES
|
| External Data Bus Width |
16
|
16
|
| Length |
14 mm
|
14 mm
|
| Number of I/O Lines |
79
|
79
|
| Number of Terminals |
100
|
100
|
| PWM Channels |
YES
|
YES
|
| Package Code |
FQFP
|
TFQFP
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, FINE PITCH
|
FLATPACK, THIN PROFILE, FINE PITCH
|
| Speed |
25 MHz
|
20 MHz
|
| Supply Voltage-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Min |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
14 mm
|
14 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
| Base Number Matches |
1
|
1
|
| Part Package Code |
|
QFP
|
| Pin Count |
|
100
|
| DAC Channels |
|
YES
|
| JESD-30 Code |
|
S-PQFP-G100
|
| Operating Temperature-Max |
|
75 °C
|
| Operating Temperature-Min |
|
-20 °C
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Qualification Status |
|
Not Qualified
|
| ROM Programmability |
|
MROM
|
| Seated Height-Max |
|
1.2 mm
|
| Temperature Grade |
|
COMMERCIAL EXTENDED
|
|
|
|