HD64180ZPJ-8X
vs
TS68C000VC8A
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
HITACHI LTD
ATMEL CORP
Part Package Code
DIP
DIP
Package Description
SDIP,
SIDE BRAZED, CERAMIC, DIP-64
Pin Count
64
64
Reach Compliance Code
unknown
unknown
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
19
24
Bit Size
8
32
Boundary Scan
NO
NO
Clock Frequency-Max
16 MHz
8 MHz
External Data Bus Width
8
16
Format
FIXED POINT
FIXED POINT
Integrated Cache
NO
NO
JESD-30 Code
R-PDIP-T64
R-CDIP-T64
Length
57.6 mm
81.28 mm
Low Power Mode
YES
NO
Number of DMA Channels
2
Number of External Interrupts
4
Number of Serial I/Os
3
Number of Terminals
64
64
On Chip Data RAM Width
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
CERAMIC, METAL-SEALED COFIRED
Package Code
SDIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE, SHRINK PITCH
IN-LINE
Qualification Status
Not Qualified
Not Qualified
RAM (words)
0
Seated Height-Max
5.08 mm
4.83 mm
Speed
8 MHz
8 MHz
Supply Current-Max
40 mA
42 mA
Supply Voltage-Max
5.5 V
5.5 V
Supply Voltage-Min
4.5 V
4.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
HCMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
1.778 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
19.05 mm
22.86 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR
MICROPROCESSOR
Base Number Matches
2
3
Rohs Code
JESD-609 Code
e0
Package Equivalence Code
DIP64,.9
Terminal Finish
Tin/Lead (Sn/Pb)
Compare HD64180ZPJ-8X with alternatives
Compare TS68C000VC8A with alternatives