HD64180ZCPJ-8X
vs
MC68000FN16R2
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Contact Manufacturer
|
Obsolete
|
| Ihs Manufacturer |
RENESAS ELECTRONICS CORP
|
MOTOROLA INC
|
| Part Package Code |
LCC
|
|
| Package Description |
PLASTIC, LCC-68
|
QCCJ,
|
| Pin Count |
68
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Address Bus Width |
20
|
23
|
| Bit Size |
8
|
32
|
| Boundary Scan |
NO
|
NO
|
| Clock Frequency-Max |
16 MHz
|
16.67 MHz
|
| External Data Bus Width |
8
|
16
|
| Format |
FIXED POINT
|
FIXED POINT
|
| Integrated Cache |
NO
|
NO
|
| JESD-30 Code |
S-PQCC-J68
|
S-PQCC-J68
|
| Length |
24.2 mm
|
|
| Low Power Mode |
YES
|
NO
|
| Number of Terminals |
68
|
68
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QCCJ
|
QCCJ
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.6 mm
|
|
| Speed |
8 MHz
|
16.67 MHz
|
| Supply Voltage-Max |
5.5 V
|
5.25 V
|
| Supply Voltage-Min |
4.5 V
|
4.75 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Form |
J BEND
|
J BEND
|
| Terminal Pitch |
1.27 mm
|
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
24.2 mm
|
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR
|
MICROPROCESSOR
|
| Base Number Matches |
2
|
2
|
| Number of DMA Channels |
|
|
| Number of External Interrupts |
|
7
|
| Number of Serial I/Os |
|
|
| On Chip Data RAM Width |
|
|
| RAM (words) |
|
0
|
| Supply Current-Max |
|
50 mA
|
|
|
|
Compare HD64180ZCPJ-8X with alternatives
Compare MC68000FN16R2 with alternatives