HD64180RFJ-6
vs
SB80C186EB-25
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Contact Manufacturer
Active
Ihs Manufacturer
RENESAS ELECTRONICS CORP
ROCHESTER ELECTRONICS LLC
Part Package Code
QFP
Package Description
PLASTIC, FP-80
SHRINK, QFP-80
Pin Count
80
Reach Compliance Code
compliant
unknown
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
20
20
Bit Size
8
16
Boundary Scan
NO
NO
Clock Frequency-Max
12.34 MHz
50 MHz
External Data Bus Width
8
16
Format
FIXED POINT
FIXED POINT
Integrated Cache
NO
NO
JESD-30 Code
R-PQFP-G80
S-PQFP-G80
JESD-609 Code
e0
Length
20 mm
12 mm
Low Power Mode
YES
YES
Number of Terminals
80
80
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QFP
LFQFP
Package Shape
RECTANGULAR
SQUARE
Package Style
FLATPACK
FLATPACK, LOW PROFILE, FINE PITCH
Qualification Status
Not Qualified
Seated Height-Max
2.9 mm
1.66 mm
Speed
6.17 MHz
25 MHz
Supply Voltage-Max
5.5 V
5.5 V
Supply Voltage-Min
4.5 V
4.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
TIN LEAD
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.8 mm
0.5 mm
Terminal Position
QUAD
QUAD
Width
14 mm
12 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR
MICROPROCESSOR
Base Number Matches
2
2
ECCN Code
3A991.A.2
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare HD64180RFJ-6 with alternatives
Compare SB80C186EB-25 with alternatives