HD6417751RF200
vs
5962-0324601Q9X
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Contact Manufacturer
Ihs Manufacturer
RENESAS ELECTRONICS CORP
E2V TECHNOLOGIES PLC
Part Package Code
QFP
DIE
Package Description
QFP-256
DIE
Pin Count
256
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
26
32
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
34 MHz
30.3 MHz
External Data Bus Width
32
32
Format
FLOATING POINT
FLOATING POINT
Integrated Cache
YES
NO
JESD-30 Code
S-PQFP-G256
X-XUUC-N
JESD-609 Code
e0
Length
28 mm
Low Power Mode
YES
YES
Number of Terminals
256
Operating Temperature-Max
75 °C
125 °C
Operating Temperature-Min
-20 °C
-55 °C
Package Body Material
PLASTIC/EPOXY
UNSPECIFIED
Package Code
FQFP
DIE
Package Shape
SQUARE
UNSPECIFIED
Package Style
FLATPACK, FINE PITCH
UNCASED CHIP
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.95 mm
Speed
200 MHz
15 MHz
Supply Voltage-Max
1.6 V
3.45 V
Supply Voltage-Min
1.35 V
3.15 V
Supply Voltage-Nom
1.5 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL EXTENDED
MILITARY
Terminal Finish
TIN LEAD
Terminal Form
GULL WING
NO LEAD
Terminal Pitch
0.4 mm
Terminal Position
QUAD
UPPER
Width
28 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
2
3
Screening Level
MIL-PRF-38535 Class Q
Compare HD6417751RF200 with alternatives
Compare 5962-0324601Q9X with alternatives