HD6417750SBP200 vs MCF54450CVM180 feature comparison

HD6417750SBP200 Hitachi Ltd

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MCF54450CVM180 Freescale Semiconductor

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Part Life Cycle Code Transferred Transferred
Ihs Manufacturer HITACHI LTD FREESCALE SEMICONDUCTOR INC
Part Package Code BGA BGA
Package Description BGA-256 17 X 17 MM, ROHS COMPLIANT, MAPBGA-256
Pin Count 256 256
Reach Compliance Code unknown compliant
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 26 32
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 67 MHz 60 MHz
External Data Bus Width 64 32
Format FLOATING POINT FIXED POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B256 S-PBGA-B256
Length 27 mm 17 mm
Low Power Mode YES YES
Number of Terminals 256 256
Operating Temperature-Max 75 °C 85 °C
Operating Temperature-Min -20 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA LBGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY, LOW PROFILE
Qualification Status Not Qualified Not Qualified
Speed 200 MHz 180 MHz
Supply Voltage-Max 2.07 V 1.65 V
Supply Voltage-Min 1.8 V 1.35 V
Supply Voltage-Nom 1.95 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL EXTENDED INDUSTRIAL
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 27 mm 17 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 2 2
Pbfree Code Yes
Rohs Code Yes
Samacsys Manufacturer NXP
Moisture Sensitivity Level 3
Package Equivalence Code BGA256,16X16,40
Peak Reflow Temperature (Cel) 260
Seated Height-Max 1.6 mm
Terminal Finish TIN SILVER COPPER OVER NICKEL
Time@Peak Reflow Temperature-Max (s) 40

Compare HD6417750SBP200 with alternatives

Compare MCF54450CVM180 with alternatives