HD6417750RF240V
vs
ACT-7000ASC-350F24T
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
RENESAS ELECTRONICS CORP
|
AEROFLEX MICROELECTRONIC SOLUTIONS
|
| Part Package Code |
HFQFP
|
|
| Package Description |
LEAD FREE, QFP-208
|
QFP, QFP208,1.2SQ,20
|
| Pin Count |
208
|
|
| Manufacturer Package Code |
PRQP0208KE
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
3A991.A.2
|
3A001.A.2.C
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Factory Lead Time |
4 Weeks
|
|
| Samacsys Manufacturer |
Renesas Electronics
|
|
| Address Bus Width |
26
|
|
| Bit Size |
32
|
64
|
| Boundary Scan |
YES
|
|
| Clock Frequency-Max |
34 MHz
|
|
| External Data Bus Width |
64
|
|
| Format |
FLOATING POINT
|
|
| Integrated Cache |
YES
|
|
| JESD-30 Code |
S-PQFP-G208
|
S-XQFP-G208
|
| JESD-609 Code |
e6
|
|
| Length |
28 mm
|
|
| Low Power Mode |
YES
|
|
| Moisture Sensitivity Level |
3
|
|
| Number of Terminals |
208
|
208
|
| Operating Temperature-Max |
75 °C
|
125 °C
|
| Operating Temperature-Min |
-20 °C
|
-55 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC
|
| Package Code |
FQFP
|
QFP
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, FINE PITCH
|
FLATPACK
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
3.56 mm
|
|
| Speed |
240 MHz
|
350 MHz
|
| Supply Voltage-Max |
1.6 V
|
|
| Supply Voltage-Min |
1.4 V
|
|
| Supply Voltage-Nom |
1.5 V
|
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL EXTENDED
|
MILITARY
|
| Terminal Finish |
TIN BISMUTH
|
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
28 mm
|
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
| Base Number Matches |
1
|
3
|
| Package Equivalence Code |
|
QFP208,1.2SQ,20
|
|
|
|
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