HD6417708F60
vs
HD6417708F60
feature comparison
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
HITACHI LTD
|
RENESAS ELECTRONICS CORP
|
| Part Package Code |
QFP
|
QFP
|
| Package Description |
LFQFP,
|
|
| Pin Count |
144
|
144
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
3A991.A.2
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Has ADC |
NO
|
NO
|
| Address Bus Width |
|
26
|
| Clock Frequency-Max |
60 MHz
|
60 MHz
|
| DAC Channels |
NO
|
|
| DMA Channels |
NO
|
NO
|
| External Data Bus Width |
32
|
32
|
| JESD-30 Code |
S-PQFP-G144
|
S-PQFP-G144
|
| Length |
20 mm
|
20 mm
|
| Number of I/O Lines |
8
|
8
|
| Number of Terminals |
144
|
144
|
| PWM Channels |
NO
|
NO
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LFQFP
|
LFQFP
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, LOW PROFILE, FINE PITCH
|
FLATPACK, LOW PROFILE, FINE PITCH
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.7 mm
|
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
20 mm
|
20 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER, RISC
|
MICROCONTROLLER, RISC
|
| Base Number Matches |
1
|
1
|
| Bit Size |
|
32
|
| CPU Family |
|
SH7000
|
| Operating Temperature-Max |
|
70 °C
|
| Operating Temperature-Min |
|
-20 °C
|
| Package Equivalence Code |
|
QFP144,.87SQ,20
|
| RAM (bytes) |
|
4096
|
| Speed |
|
60 MHz
|
| Supply Current-Max |
|
200 mA
|
| Supply Voltage-Max |
|
3.6 V
|
| Supply Voltage-Min |
|
3 V
|
| Temperature Grade |
|
COMMERCIAL
|
|
|
|