HD6417032FI20
vs
HD6477034F20V
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
RENESAS ELECTRONICS CORP
|
RENESAS ELECTRONICS CORP
|
| Part Package Code |
QFP
|
QFP
|
| Package Description |
QFP, QFP112,.91SQ
|
20 X 20 MM, 0.65 MM PITCH, PLASTIC, QFP-112
|
| Pin Count |
112
|
112
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Has ADC |
YES
|
YES
|
| Address Bus Width |
22
|
22
|
| Bit Size |
32
|
32
|
| CPU Family |
SH7000
|
SH7000
|
| Clock Frequency-Max |
20 MHz
|
20 MHz
|
| DAC Channels |
NO
|
NO
|
| DMA Channels |
YES
|
YES
|
| External Data Bus Width |
16
|
16
|
| JESD-30 Code |
S-PQFP-G112
|
S-PQFP-G112
|
| Length |
20 mm
|
20 mm
|
| Number of I/O Lines |
40
|
40
|
| Number of Terminals |
112
|
112
|
| Operating Temperature-Max |
85 °C
|
75 °C
|
| Operating Temperature-Min |
-40 °C
|
-20 °C
|
| PWM Channels |
YES
|
YES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QFP
|
QFP
|
| Package Equivalence Code |
QFP112,.91SQ
|
QFP112,.91SQ
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK
|
FLATPACK
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RAM (bytes) |
8192
|
4096
|
| Seated Height-Max |
3.05 mm
|
3.05 mm
|
| Speed |
20 MHz
|
20 MHz
|
| Supply Current-Max |
130 mA
|
60 mA
|
| Supply Voltage-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Min |
4.5 V
|
5 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL EXTENDED
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
0.65 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
20 mm
|
20 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER, RISC
|
MICROCONTROLLER, RISC
|
| Base Number Matches |
2
|
1
|
| Pbfree Code |
|
Yes
|
| Rohs Code |
|
Yes
|
| Manufacturer Package Code |
|
PRQP0112JA
|
| Samacsys Manufacturer |
|
Renesas Electronics
|
| JESD-609 Code |
|
e6
|
| Moisture Sensitivity Level |
|
3
|
| On Chip Program ROM Width |
|
8
|
| Peak Reflow Temperature (Cel) |
|
260
|
| ROM (words) |
|
65536
|
| ROM Programmability |
|
OTPROM
|
| Terminal Finish |
|
TIN BISMUTH
|
| Time@Peak Reflow Temperature-Max (s) |
|
20
|
|
|
|
Compare HD6417032FI20 with alternatives
Compare HD6477034F20V with alternatives