HD14512BRP
vs
5962R9667702VEC
feature comparison
Part Life Cycle Code |
Contact Manufacturer
|
Obsolete
|
Ihs Manufacturer |
RENESAS ELECTRONICS CORP
|
HARRIS SEMICONDUCTOR
|
Part Package Code |
SOIC
|
|
Package Description |
SOP,
|
DIP,
|
Pin Count |
16
|
|
Reach Compliance Code |
compliant
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Family |
4000/14000/40000
|
4000/14000/40000
|
JESD-30 Code |
R-PDSO-G16
|
R-CDIP-T16
|
Length |
9.9 mm
|
|
Logic IC Type |
MULTIPLEXER
|
MULTIPLEXER
|
Number of Functions |
1
|
4
|
Number of Inputs |
8
|
2
|
Number of Outputs |
1
|
1
|
Number of Terminals |
16
|
16
|
Operating Temperature-Max |
85 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-55 °C
|
Output Polarity |
TRUE
|
TRUE
|
Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, METAL-SEALED COFIRED
|
Package Code |
SOP
|
DIP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
IN-LINE
|
Propagation Delay (tpd) |
750 ns
|
513 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.75 mm
|
|
Supply Voltage-Max (Vsup) |
18 V
|
18 V
|
Supply Voltage-Min (Vsup) |
3 V
|
3 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
YES
|
NO
|
Temperature Grade |
INDUSTRIAL
|
MILITARY
|
Terminal Form |
GULL WING
|
THROUGH-HOLE
|
Terminal Pitch |
1.27 mm
|
|
Terminal Position |
DUAL
|
DUAL
|
Width |
3.9 mm
|
|
Base Number Matches |
2
|
2
|
JESD-609 Code |
|
e4
|
Output Characteristics |
|
3-STATE
|
Technology |
|
CMOS
|
Terminal Finish |
|
GOLD
|
Total Dose |
|
100k Rad(Si) V
|
|
|
|
Compare HD14512BRP with alternatives
Compare 5962R9667702VEC with alternatives