HD14069UBP
vs
HEF4069UBDB
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Contact Manufacturer
Obsolete
Ihs Manufacturer
RENESAS ELECTRONICS CORP
NXP SEMICONDUCTORS
Part Package Code
DIP
Package Description
DIP,
DIP,
Pin Count
14
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
4000/14000/40000
4000/14000/40000
JESD-30 Code
R-PDIP-T14
R-GDIP-T14
Length
19.2 mm
Logic IC Type
INVERTER
INVERTER
Number of Functions
6
6
Number of Inputs
1
1
Number of Terminals
14
14
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Propagation Delay (tpd)
125 ns
90 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.06 mm
5.08 mm
Supply Voltage-Max (Vsup)
18 V
15 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
7.62 mm
Base Number Matches
2
1
Load Capacitance (CL)
50 pF
Technology
CMOS
Compare HD14069UBP with alternatives
Compare HEF4069UBDB with alternatives