HD14050BFP
vs
MC14050BDR2
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
HITACHI LTD
MOTOROLA SEMICONDUCTOR PRODUCTS
Part Package Code
SOIC
Package Description
SOP,
SOP, SOP16,.25
Pin Count
16
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
Family
4000/14000/40000
JESD-30 Code
R-PDSO-G16
R-PDSO-G16
Length
10.06 mm
Logic IC Type
INVERTER
BUFFER
Number of Functions
6
Number of Inputs
1
Number of Terminals
16
16
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Propagation Delay (tpd)
160 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.2 mm
Supply Voltage-Max (Vsup)
18 V
Supply Voltage-Min (Vsup)
3 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
YES
YES
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Width
5.5 mm
Base Number Matches
2
4
Rohs Code
JESD-609 Code
e0
Package Equivalence Code
SOP16,.25
Packing Method
TAPE AND REEL
Power Supplies
5/15 V
Schmitt Trigger
NO
Technology
CMOS
Terminal Finish
Tin/Lead (Sn/Pb)
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