HD14044BP
vs
MC14044BDR2
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Contact Manufacturer
Obsolete
Ihs Manufacturer
RENESAS ELECTRONICS CORP
MOTOROLA SEMICONDUCTOR PRODUCTS
Part Package Code
DIP
Package Description
DIP,
SOP, SOP16,.25
Pin Count
16
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
Family
4000/14000/40000
JESD-30 Code
R-PDIP-T16
R-PDSO-G16
Length
19.2 mm
Logic IC Type
R-S LATCH
R-S LATCH
Number of Bits
4
1
Number of Functions
1
4
Number of Terminals
16
16
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Output Characteristics
3-STATE
3-STATE
Output Polarity
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
SOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
SMALL OUTLINE
Propagation Delay (tpd)
350 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.06 mm
Supply Voltage-Max (Vsup)
18 V
Supply Voltage-Min (Vsup)
3 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Form
THROUGH-HOLE
GULL WING
Terminal Pitch
2.54 mm
1.27 mm
Terminal Position
DUAL
DUAL
Trigger Type
LOW LEVEL
Width
7.62 mm
Base Number Matches
2
5
Rohs Code
JESD-609 Code
e0
Load Capacitance (CL)
50 pF
Max I(ol)
0.00088 A
Package Equivalence Code
SOP16,.25
Packing Method
TAPE AND REEL
Power Supplies
5/15 V
Prop. Delay@Nom-Sup
350 ns
Terminal Finish
Tin/Lead (Sn/Pb)
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