HD14027BP vs MC14027BDR2G feature comparison

HD14027BP Renesas Electronics Corporation

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MC14027BDR2G onsemi

Buy Now Datasheet
Part Life Cycle Code Transferred Active
Ihs Manufacturer RENESAS ELECTRONICS CORP ONSEMI
Part Package Code DIP SOIC 16 LEAD
Package Description DIP, SOIC-16
Pin Count 16 16
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family 4000/14000/40000 4000/14000/40000
JESD-30 Code R-PDIP-T16 R-PDSO-G16
Length 19.2 mm 9.9 mm
Logic IC Type J-K FLIP-FLOP J-K FLIP-FLOP
Number of Bits 2 2
Number of Functions 2 2
Number of Terminals 16 16
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Output Polarity COMPLEMENTARY COMPLEMENTARY
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Propagation Delay (tpd) 400 ns 350 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.06 mm 1.75 mm
Supply Voltage-Max (Vsup) 18 V 18 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 7.62 mm 3.9 mm
fmax-Min 6.5 MHz 6.5 MHz
Base Number Matches 2 1
Pbfree Code Yes
Manufacturer Package Code 751B-05
ECCN Code EAR99
Samacsys Manufacturer onsemi
JESD-609 Code e3
Load Capacitance (CL) 50 pF
Max Frequency@Nom-Sup 1500000 Hz
Moisture Sensitivity Level 1
Package Equivalence Code SOP16,.25
Packing Method TR
Peak Reflow Temperature (Cel) 260
Terminal Finish MATTE TIN
Time@Peak Reflow Temperature-Max (s) 30

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Compare MC14027BDR2G with alternatives