HD14011BRP vs BU4011BF-E1 feature comparison

HD14011BRP Renesas Electronics Corporation

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BU4011BF-E1 ROHM Semiconductor

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Part Life Cycle Code Contact Manufacturer Obsolete
Ihs Manufacturer RENESAS ELECTRONICS CORP ROHM CO LTD
Part Package Code SOIC SOIC
Package Description SOP, LSOP, SOP14,.25
Pin Count 14 14
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family 4000/14000/40000 4000/14000/40000
JESD-30 Code R-PDSO-G14 R-PDSO-G14
Length 8.65 mm 8.7 mm
Logic IC Type NAND GATE NAND GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP LSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE, LOW PROFILE
Propagation Delay (tpd) 250 ns 180 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm 1.7 mm
Supply Voltage-Max (Vsup) 18 V 16 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Width 3.9 mm 4.4 mm
Base Number Matches 2 1
Pbfree Code Yes
Rohs Code Yes
JESD-609 Code e2
Load Capacitance (CL) 50 pF
Package Equivalence Code SOP14,.25
Packing Method TR
Prop. Delay@Nom-Sup 180 ns
Schmitt Trigger NO
Technology CMOS
Terminal Finish TIN COPPER

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Compare BU4011BF-E1 with alternatives