HD14011BP
vs
MC14011BCLDS
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
RENESAS ELECTRONICS CORP
MOTOROLA SEMICONDUCTOR PRODUCTS
Part Package Code
DIP
Package Description
DIP,
DIP, DIP14,.3
Pin Count
14
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
Family
4000/14000/40000
4000/14000/40000
JESD-30 Code
R-PDIP-T14
R-XDIP-T14
Length
19.2 mm
19.495 mm
Logic IC Type
NAND GATE
NAND GATE
Number of Functions
4
4
Number of Inputs
2
2
Number of Terminals
14
14
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
CERAMIC
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Propagation Delay (tpd)
250 ns
250 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.06 mm
5.08 mm
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
7.62 mm
Base Number Matches
1
1
Rohs Code
Category CO2 Kg
12.4
JESD-609 Code
e0
Load Capacitance (CL)
50 pF
Package Equivalence Code
DIP14,.3
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Power Supplies
5/15 V
Schmitt Trigger
NO
Supply Voltage-Max (Vsup)
18 V
Supply Voltage-Min (Vsup)
3 V
Technology
CMOS
Terminal Finish
Tin/Lead (Sn/Pb)
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare HD14011BP with alternatives
Compare MC14011BCLDS with alternatives