HD14001BP vs MC14001BCLD feature comparison

HD14001BP Renesas Electronics Corporation

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MC14001BCLD Motorola Semiconductor Products

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Part Life Cycle Code Contact Manufacturer Obsolete
Ihs Manufacturer RENESAS ELECTRONICS CORP MOTOROLA INC
Part Package Code DIP
Package Description DIP, DIP, DIP14,.3
Pin Count 14
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family 4000/14000/40000 4000/14000/40000
JESD-30 Code R-PDIP-T14 R-GDIP-T14
Length 19.2 mm 19.495 mm
Logic IC Type NOR GATE NOR GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 250 ns 250 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.06 mm 5.08 mm
Supply Voltage-Max (Vsup) 18 V 18 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 2 3
Rohs Code No
JESD-609 Code e0
Load Capacitance (CL) 50 pF
Package Equivalence Code DIP14,.3
Schmitt Trigger NO
Technology CMOS
Terminal Finish TIN LEAD

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