HD115531B5808
vs
HD1-6409-2
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
INTERSIL CORP
|
HARRIS SEMICONDUCTOR
|
| Part Package Code |
DIP
|
|
| Package Description |
CERDIP-40
|
|
| Pin Count |
40
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| JESD-30 Code |
R-GDIP-T40
|
R-GDIP-T20
|
| JESD-609 Code |
e0
|
e0
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
40
|
20
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
CERAMIC, GLASS-SEALED
|
| Package Code |
DIP
|
DIP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
5.72 mm
|
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Telecom IC Type |
MANCHESTER ENCODER/DECODER
|
MANCHESTER ENCODER/DECODER
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
15.24 mm
|
|
| Base Number Matches |
1
|
4
|
| Rohs Code |
|
No
|
| Package Equivalence Code |
|
DIP20,.3
|
|
|
|
Compare HD115531B5808 with alternatives
Compare HD1-6409-2 with alternatives