HD10174
vs
MC10174FNR2
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
HITACHI LTD
ON SEMICONDUCTOR
Package Description
DIP, DIP16,.3
PLASTIC, LCC-20
Reach Compliance Code
unknown
not_compliant
HTS Code
8542.39.00.01
8542.39.00.01
Family
10K
10K
JESD-30 Code
R-GDIP-T16
S-PQCC-J20
JESD-609 Code
e0
e0
Length
19.3 mm
8.965 mm
Logic IC Type
MULTIPLEXER
MULTIPLEXER
Number of Functions
2
2
Number of Inputs
4
4
Number of Outputs
1
1
Number of Terminals
16
20
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-30 °C
-30 °C
Output Characteristics
OPEN-EMITTER
OPEN-EMITTER
Output Polarity
TRUE
TRUE
Package Body Material
CERAMIC, GLASS-SEALED
PLASTIC/EPOXY
Package Code
DIP
QCCJ
Package Equivalence Code
DIP16,.3
LDCC20,.4SQ
Package Shape
RECTANGULAR
SQUARE
Package Style
IN-LINE
CHIP CARRIER
Power Supply Current-Max (ICC)
73 mA
Propagation Delay (tpd)
6.4 ns
6.2 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.06 mm
4.57 mm
Surface Mount
NO
YES
Technology
ECL
ECL
Temperature Grade
OTHER
OTHER
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
THROUGH-HOLE
J BEND
Terminal Pitch
2.54 mm
1.27 mm
Terminal Position
DUAL
QUAD
Width
7.62 mm
8.965 mm
Base Number Matches
1
3
Part Package Code
QLCC
Pin Count
20
Moisture Sensitivity Level
1
Packing Method
TR
Peak Reflow Temperature (Cel)
235
Prop. Delay@Nom-Sup
6.6 ns
Compare HD10174 with alternatives
Compare MC10174FNR2 with alternatives