Findchips: Compare HCTS86HMSR vs 74ALVC32BQ,115

HCTS86HMSR vs 74ALVC32BQ,115 feature comparison

Buy Now Datasheet

Buy Now Datasheet

Part Life Cycle Code	Obsolete	Active
Ihs Manufacturer	HARRIS SEMICONDUCTOR	NEXPERIA
Package Description	DIE,	2.50 X 3 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT762-1, DHVQFN-14
Reach Compliance Code	unknown	compliant
HTS Code	8542.39.00.01	8542.39.00.01
Family	HCT	ALVC/VCX/A
JESD-30 Code	X-XUUC-N14	R-PQCC-N14
Load Capacitance (CL)	50 pF
Logic IC Type	XOR GATE	OR GATE
Number of Functions	4	4
Number of Inputs	2	2
Number of Terminals	14	14
Operating Temperature-Max	125 °C	85 °C
Operating Temperature-Min	-55 °C	-40 °C
Package Body Material	UNSPECIFIED	PLASTIC/EPOXY
Package Code	DIE	HVQCCN
Package Equivalence Code	DIE OR CHIP
Package Shape	UNSPECIFIED	RECTANGULAR
Package Style	UNCASED CHIP	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Propagation Delay (tpd)	20 ns	4.7 ns
Qualification Status	Not Qualified	Not Qualified
Supply Voltage-Max (Vsup)	5.5 V	3.6 V
Supply Voltage-Min (Vsup)	4.5 V	1.65 V
Supply Voltage-Nom (Vsup)	5 V	2.7 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Temperature Grade	MILITARY	INDUSTRIAL
Terminal Form	NO LEAD	NO LEAD
Terminal Position	UPPER	QUAD
Base Number Matches	1	1
Rohs Code		Yes
Part Package Code		QFN
Pin Count		14
Manufacturer Package Code		SOT762-1
Factory Lead Time		8 Weeks
Samacsys Manufacturer		Nexperia
JESD-609 Code		e4
Length		3 mm
Moisture Sensitivity Level		1
Packing Method		TR, 7 INCH
Peak Reflow Temperature (Cel)		260
Seated Height-Max		1 mm
Terminal Finish		NICKEL PALLADIUM GOLD
Terminal Pitch		0.5 mm
Time@Peak Reflow Temperature-Max (s)		30
Width		2.5 mm
	Logic » Gates	Logic » Gates