HCTS75DMSH vs 74HCT75NB feature comparison

HCTS75DMSH Intersil Corporation

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74HCT75NB NXP Semiconductors

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer HARRIS SEMICONDUCTOR NXP SEMICONDUCTORS
Package Description , DIP,
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature RADIATION HARD CMOS/SILICON ON SAPPHIRE (SOS) TECHNOLOGY
Family HCT HCT
JESD-30 Code R-CDIP-T16 R-PDIP-T16
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type D LATCH D LATCH
Number of Bits 2 2
Number of Functions 2 2
Number of Terminals 16 16
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -40 °C
Output Polarity COMPLEMENTARY COMPLEMENTARY
Package Body Material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY AUTOMOTIVE
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Trigger Type HIGH LEVEL HIGH LEVEL
Base Number Matches 2 1
Length 19.025 mm
Package Equivalence Code DIP16,.3
Propagation Delay (tpd) 45 ns
Seated Height-Max 4.2 mm
Terminal Pitch 2.54 mm
Width 7.62 mm

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