HCTS373HMSR
vs
5962R9574701VRC
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTERSIL CORP
INTERSIL CORP
Part Package Code
DIE
DIP
Package Description
DIE,
DIP, DIP20,.3
Pin Count
20
20
Reach Compliance Code
unknown
unknown
Family
HCT
HCT
JESD-30 Code
R-XUUC-N20
R-CDIP-T20
Logic IC Type
BUS DRIVER
BUS DRIVER
Number of Bits
8
8
Number of Functions
1
1
Number of Ports
2
2
Number of Terminals
20
20
Output Characteristics
3-STATE
3-STATE
Output Polarity
TRUE
TRUE
Package Body Material
UNSPECIFIED
CERAMIC, METAL-SEALED COFIRED
Package Code
DIE
DIP
Package Equivalence Code
DIE OR CHIP
DIP20,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
UNCASED CHIP
IN-LINE
Propagation Delay (tpd)
30 ns
34 ns
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-PRF-38535 Class V
38535V;38534K;883S
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Terminal Form
NO LEAD
THROUGH-HOLE
Terminal Position
UPPER
DUAL
Total Dose
200k Rad(Si) V
100k Rad(Si) V
Base Number Matches
1
1
HTS Code
8542.39.00.01
JESD-609 Code
e4
Load Capacitance (CL)
50 pF
Max I(ol)
0.006 A
Operating Temperature-Max
125 °C
Operating Temperature-Min
-55 °C
Prop. Delay@Nom-Sup
30 ns
Seated Height-Max
5.08 mm
Temperature Grade
MILITARY
Terminal Finish
GOLD
Terminal Pitch
2.54 mm
Width
7.62 mm
Compare HCTS373HMSR with alternatives
Compare 5962R9574701VRC with alternatives