HCTS373DTR vs HCTS373HMSR feature comparison

HCTS373DTR Intersil Corporation

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HCTS373HMSR Harris Semiconductor

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTERSIL CORP HARRIS SEMICONDUCTOR
Part Package Code DIP
Package Description DIP, DIP20,.3 DIE,
Pin Count 20
Reach Compliance Code not_compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family HCT HCT
JESD-30 Code R-CDIP-T20 X-XUUC-N20
JESD-609 Code e0
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type BUS DRIVER BUS DRIVER
Max I(ol) 0.006 A
Number of Bits 8 8
Number of Functions 1 1
Number of Ports 2 2
Number of Terminals 20 20
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material CERAMIC, METAL-SEALED COFIRED UNSPECIFIED
Package Code DIP DIE
Package Equivalence Code DIP20,.3
Package Shape RECTANGULAR UNSPECIFIED
Package Style IN-LINE UNCASED CHIP
Prop. Delay@Nom-Sup 30 ns
Qualification Status Not Qualified Not Qualified
Screening Level MIL-PRF-38535 Class T
Seated Height-Max 5.08 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE NO LEAD
Terminal Pitch 2.54 mm
Terminal Position DUAL UPPER
Total Dose 100k Rad(Si) V
Width 7.62 mm
Base Number Matches 1 1
Propagation Delay (tpd) 34 ns

Compare HCTS373DTR with alternatives

Compare HCTS373HMSR with alternatives