HCTS138K/SAMPLE
vs
M54HC138K
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
HARRIS SEMICONDUCTOR
STMICROELECTRONICS
Package Description
,
DFP, FL16,.3
Reach Compliance Code
unknown
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Family
HCT
HCT
JESD-30 Code
R-CDFP-F16
R-CDFP-F16
Load Capacitance (CL)
50 pF
50 pF
Number of Functions
1
1
Number of Terminals
16
16
Output Polarity
INVERTED
INVERTED
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
DFP
DFP
Package Equivalence Code
FL16,.3
FL16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
FLATPACK
FLATPACK
Propagation Delay (tpd)
39 ns
45 ns
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Form
FLAT
FLAT
Terminal Position
DUAL
DUAL
Base Number Matches
2
1
Pbfree Code
Rohs Code
Part Package Code
DFP
Pin Count
16
Input Conditioning
STANDARD
JESD-609 Code
e0
Length
9.94 mm
Logic IC Type
3-LINE TO 8-LINE DECODER
Max I(ol)
0.004 A
Operating Temperature-Max
125 °C
Operating Temperature-Min
-55 °C
Power Supply Current-Max (ICC)
0.08 mA
Prop. Delay@Nom-Sup
38 ns
Seated Height-Max
2.38 mm
Temperature Grade
MILITARY
Terminal Finish
TIN LEAD
Terminal Pitch
1.27 mm
Total Dose
50k Rad(Si) V
Width
6.91 mm
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