HCTS138D/SAMPLE
vs
10561/BEAJC
feature comparison
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
HARRIS SEMICONDUCTOR
|
MOTOROLA SEMICONDUCTOR PRODUCTS
|
Package Description |
,
|
DIP, DIP16,.3
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.39.00.01
|
|
Family |
HCT
|
|
JESD-30 Code |
R-CDIP-T16
|
R-XDIP-T16
|
Load Capacitance (CL) |
50 pF
|
|
Logic IC Type |
3-LINE TO 8-LINE DECODER
|
OTHER DECODER/DRIVER
|
Number of Functions |
1
|
1
|
Number of Terminals |
16
|
16
|
Output Polarity |
INVERTED
|
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC
|
Package Code |
DIP
|
DIP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
IN-LINE
|
Propagation Delay (tpd) |
39 ns
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Supply Voltage-Max (Vsup) |
5.5 V
|
|
Supply Voltage-Min (Vsup) |
4.5 V
|
|
Supply Voltage-Nom (Vsup) |
5 V
|
|
Surface Mount |
NO
|
NO
|
Technology |
CMOS
|
ECL10K
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Position |
DUAL
|
DUAL
|
Base Number Matches |
2
|
3
|
Rohs Code |
|
No
|
JESD-609 Code |
|
e0
|
Operating Temperature-Max |
|
125 °C
|
Operating Temperature-Min |
|
-55 °C
|
Package Equivalence Code |
|
DIP16,.3
|
Power Supplies |
|
-5.2 V
|
Power Supply Current-Max (ICC) |
|
84 mA
|
Prop. Delay@Nom-Sup |
|
7 ns
|
Screening Level |
|
38535Q/M;38534H;883B
|
Temperature Grade |
|
MILITARY
|
Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
Terminal Pitch |
|
2.54 mm
|
|
|
|