HCS515/P
vs
HCS512T/SO
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Part Package Code |
DIP
|
SOIC
|
Package Description |
0.300 INCH, PLASTIC, DIP-14
|
0.300 INCH, PLASTIC, SOIC-18
|
Pin Count |
14
|
18
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.31.00.01
|
8542.39.00.01
|
Factory Lead Time |
4 Weeks
|
6 Weeks
|
Samacsys Manufacturer |
Microchip
|
Microchip
|
JESD-30 Code |
R-PDIP-T14
|
R-PDSO-G18
|
JESD-609 Code |
e3
|
e3
|
Length |
19.05 mm
|
11.55 mm
|
Number of Functions |
1
|
1
|
Number of Terminals |
14
|
18
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
DIP
|
SOP
|
Package Equivalence Code |
DIP14,.3
|
SOP18,.4
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
SMALL OUTLINE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Screening Level |
TS 16949
|
TS 16949
|
Seated Height-Max |
5.334 mm
|
2.65 mm
|
Supply Current-Max |
2 mA
|
10 mA
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
NO
|
YES
|
Technology |
CMOS
|
CMOS
|
Telecom IC Type |
DATA ENCRYPTION CIRCUIT
|
DATA ENCRYPTION CIRCUIT
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Finish |
MATTE TIN
|
MATTE TIN
|
Terminal Form |
THROUGH-HOLE
|
GULL WING
|
Terminal Pitch |
2.54 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
DUAL
|
Width |
7.62 mm
|
7.5 mm
|
Base Number Matches |
1
|
1
|
Moisture Sensitivity Level |
|
1
|
Peak Reflow Temperature (Cel) |
|
260
|
|
|
|
Compare HCS515/P with alternatives
Compare HCS512T/SO with alternatives