HCS512T-I/SO
vs
HCS515-I/P
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROCHIP TECHNOLOGY INC
Part Package Code
SOIC
DIP
Package Description
0.300 INCH, PLASTIC, SOIC-18
0.300 INCH, PLASTIC, DIP-14
Pin Count
18
14
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
HTS Code
8542.31.00.01
8542.39.00.01
Factory Lead Time
4 Weeks
10 Weeks
Samacsys Manufacturer
Microchip
Microchip
JESD-30 Code
R-PDSO-G18
R-PDIP-T14
JESD-609 Code
e3
e3
Length
11.55 mm
19.05 mm
Moisture Sensitivity Level
2
Number of Functions
1
1
Number of Terminals
18
14
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
DIP
Package Equivalence Code
SOP18,.4
DIP14,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
IN-LINE
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Not Qualified
Screening Level
TS 16949
TS 16949
Seated Height-Max
2.65 mm
5.334 mm
Supply Current-Max
10 mA
2 mA
Supply Voltage-Nom
5 V
5 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Telecom IC Type
DATA ENCRYPTION CIRCUIT
DATA ENCRYPTION CIRCUIT
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Matte Tin (Sn)
MATTE TIN
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Pitch
1.27 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
40
Width
7.5 mm
7.62 mm
Base Number Matches
1
1
Compare HCS512T-I/SO with alternatives
Compare HCS515-I/P with alternatives