HCS500T-I/SM vs HCS410-I/ST feature comparison

HCS500T-I/SM Microchip Technology Inc

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HCS410-I/ST Microchip Technology Inc

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Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROCHIP TECHNOLOGY INC
Part Package Code SOIC SOIC
Package Description 0.207 INCH, PLASTIC, SOIC-8 4.40 MM, TSSOP-8
Pin Count 8 8
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code R-PDSO-G8 R-PDSO-G8
JESD-609 Code e3 e3
Length 4.9 mm 4.4 mm
Number of Functions 1 1
Number of Terminals 8 8
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP TSSOP
Package Equivalence Code SOP8,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel) 260 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm 1.2 mm
Supply Current-Max 2.4 mA 3.5 mA
Supply Voltage-Nom 5 V 3 V
Surface Mount YES YES
Technology CMOS
Telecom IC Type DATA ENCRYPTION CIRCUIT DATA ENCRYPTION CIRCUIT
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Matte Tin (Sn) MATTE TIN
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 40 40
Width 3.9 mm 3 mm
Base Number Matches 1 1
Moisture Sensitivity Level 1

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