HCS500/P
vs
HCS410T-/ST
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROCHIP TECHNOLOGY INC
Part Package Code
DIP
SOIC
Package Description
0.300 INCH, PLASTIC, DIP-8
SOP,
Pin Count
8
8
Reach Compliance Code
compliant
compliant
Samacsys Manufacturer
Microchip
JESD-30 Code
R-PDIP-T8
R-PDSO-G8
JESD-609 Code
e3
e3
Length
9.46 mm
Number of Functions
1
1
Number of Terminals
8
8
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
SOP
Package Equivalence Code
DIP8,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
SMALL OUTLINE
Peak Reflow Temperature (Cel)
NOT SPECIFIED
260
Power Supplies
3.3/5 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.32 mm
Supply Voltage-Nom
5 V
3 V
Surface Mount
NO
YES
Technology
CMOS
Telecom IC Type
DATA ENCRYPTION CIRCUIT
DATA ENCRYPTION CIRCUIT
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
Matte Tin (Sn)
Matte Tin (Sn)
Terminal Form
THROUGH-HOLE
GULL WING
Terminal Pitch
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
40
Width
7.62 mm
Base Number Matches
1
1
Moisture Sensitivity Level
1
Compare HCS500/P with alternatives
Compare HCS410T-/ST with alternatives