HCS320/SN
vs
HCS500/P
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROCHIP TECHNOLOGY INC
Part Package Code
SOIC
DIP
Package Description
0.150 INCH, PLASTIC, SOIC-8
0.300 INCH, PLASTIC, DIP-8
Pin Count
8
8
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
Samacsys Manufacturer
Microchip
Microchip
JESD-30 Code
R-PDSO-G8
R-PDIP-T8
JESD-609 Code
e3
e3
Length
4.9 mm
9.46 mm
Moisture Sensitivity Level
3
Number of Functions
1
1
Number of Terminals
8
8
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
IN-LINE
Peak Reflow Temperature (Cel)
260
NOT SPECIFIED
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.75 mm
4.32 mm
Supply Current-Max
15 mA
Supply Voltage-Nom
5 V
5 V
Surface Mount
YES
NO
Telecom IC Type
DATA ENCRYPTION CIRCUIT
DATA ENCRYPTION CIRCUIT
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
Matte Tin (Sn)
Matte Tin (Sn)
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Pitch
1.27 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
40
NOT SPECIFIED
Width
3.9116 mm
7.62 mm
Base Number Matches
1
1
Package Equivalence Code
DIP8,.3
Power Supplies
3.3/5 V
Technology
CMOS
Compare HCS320/SN with alternatives
Compare HCS500/P with alternatives