HCS151D/SAMPLE
vs
TC74HC352AP
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
INTERSIL CORP
TOSHIBA CORP
Part Package Code
DIP
DIP
Package Description
DIP,
DIP, DIP16,.3
Pin Count
16
16
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
HC/UH
HC/UH
JESD-30 Code
R-CDIP-T16
R-PDIP-T16
Logic IC Type
MULTIPLEXER
MULTIPLEXER
Number of Functions
1
2
Number of Inputs
8
4
Number of Outputs
1
1
Number of Terminals
16
16
Output Polarity
COMPLEMENTARY
INVERTED
Package Body Material
CERAMIC, METAL-SEALED COFIRED
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Propagation Delay (tpd)
27 ns
43 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.08 mm
4.45 mm
Supply Voltage-Max (Vsup)
5.5 V
6 V
Supply Voltage-Min (Vsup)
4.5 V
2 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
7.62 mm
Base Number Matches
2
1
Rohs Code
No
JESD-609 Code
e0
Length
19.25 mm
Load Capacitance (CL)
50 pF
Max I(ol)
0.0052 A
Operating Temperature-Max
85 °C
Operating Temperature-Min
-40 °C
Package Equivalence Code
DIP16,.3
Prop. Delay@Nom-Sup
43 ns
Temperature Grade
INDUSTRIAL
Terminal Finish
Tin/Lead (Sn/Pb)
Compare HCS151D/SAMPLE with alternatives
Compare TC74HC352AP with alternatives