HCS151D/SAMPLE vs TC74HC352AP feature comparison

HCS151D/SAMPLE Intersil Corporation

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TC74HC352AP Toshiba America Electronic Components

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Part Life Cycle Code Obsolete Active
Ihs Manufacturer INTERSIL CORP TOSHIBA CORP
Part Package Code DIP DIP
Package Description DIP, DIP, DIP16,.3
Pin Count 16 16
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-CDIP-T16 R-PDIP-T16
Logic IC Type MULTIPLEXER MULTIPLEXER
Number of Functions 1 2
Number of Inputs 8 4
Number of Outputs 1 1
Number of Terminals 16 16
Output Polarity COMPLEMENTARY INVERTED
Package Body Material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 27 ns 43 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 4.45 mm
Supply Voltage-Max (Vsup) 5.5 V 6 V
Supply Voltage-Min (Vsup) 4.5 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 2 1
Rohs Code No
JESD-609 Code e0
Length 19.25 mm
Load Capacitance (CL) 50 pF
Max I(ol) 0.0052 A
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Equivalence Code DIP16,.3
Prop. Delay@Nom-Sup 43 ns
Temperature Grade INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb)

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Compare TC74HC352AP with alternatives