HCS101T-/SN
vs
HCS500-/P
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROCHIP TECHNOLOGY INC
Part Package Code
SOIC
DIP
Package Description
SOP,
0.300 INCH, PLASTIC, DIP-8
Pin Count
8
8
Reach Compliance Code
compliant
compliant
JESD-30 Code
R-PDSO-G8
R-PDIP-T8
JESD-609 Code
e3
e3
Moisture Sensitivity Level
1
Number of Functions
1
1
Number of Terminals
8
8
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
IN-LINE
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Nom
5 V
5 V
Surface Mount
YES
NO
Telecom IC Type
DATA ENCRYPTION CIRCUIT
DATA ENCRYPTION CIRCUIT
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
MATTE TIN
MATTE TIN
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
40
Base Number Matches
2
2
HTS Code
8542.39.00.01
Package Equivalence Code
DIP8,.3
Supply Current-Max
2.4 mA
Technology
CMOS
Terminal Pitch
2.54 mm
Compare HCS101T-/SN with alternatives
Compare HCS500-/P with alternatives