HCPL7820#500 vs HCPL-7851200 feature comparison

HCPL7820#500 Hewlett Packard Co

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HCPL-7851200 Avago Technologies

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Part Life Cycle Code Transferred Active
Ihs Manufacturer HEWLETT PACKARD CO AVAGO TECHNOLOGIES INC
Part Package Code SOIC DIP
Package Description SOP, DIP,
Pin Count 8 8
Reach Compliance Code unknown compliant
ECCN Code EAR99
HTS Code 8542.33.00.01
Amplifier Type ISOLATION AMPLIFIER ISOLATION AMPLIFIER
Bandwidth (3dB)-Nom 200 MHz 100 MHz
Common Mode Voltage-Max 3750 V
Isolation Voltage-Min 3750 V
JESD-30 Code R-PDSO-G8 R-PDIP-T8
Number of Functions 1 1
Number of Terminals 8 8
Operating Temperature-Max 100 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Qualification Status Not Qualified Not Qualified
Supply Voltage Limit-Max 5.5 V 5.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Form GULL WING THROUGH-HOLE
Terminal Position DUAL DUAL
Voltage Gain-Max 8.4 8.4
Voltage Gain-Min 7.6 7.6
Base Number Matches 2 2
Pbfree Code Yes
Rohs Code Yes
Length 9.655 mm
Peak Reflow Temperature (Cel) NOT SPECIFIED
Seated Height-Max 4.32 mm
Terminal Pitch 2.54 mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 7.62 mm

Compare HCPL7820#500 with alternatives

Compare HCPL-7851200 with alternatives