HCPL-J456500
vs
HCPL-J456300
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
HEWLETT PACKARD CO
|
HEWLETT PACKARD CO
|
| Package Description |
300 MIL, WHITE MOLD, DIP-8
|
300 MIL, WHITE MOLD, DIP-8
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8541.40.80.00
|
8541.40.80.00
|
| Additional Feature |
UL RECOGNIZED, VDE APPROVED
|
UL RECOGNIZED, VDE APPROVED
|
| Configuration |
SINGLE
|
SINGLE
|
| Forward Current-Max |
0.025 A
|
0.025 A
|
| Isolation Voltage-Max |
3750 V
|
3750 V
|
| Number of Elements |
1
|
1
|
| Number of Functions |
1
|
1
|
| On-State Current-Max |
0.015 A
|
0.015 A
|
| Operating Temperature-Max |
100 °C
|
100 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Optoelectronic Device Type |
LOGIC IC OUTPUT OPTOCOUPLER
|
LOGIC IC OUTPUT OPTOCOUPLER
|
| Base Number Matches |
1
|
1
|
| Rohs Code |
|
No
|
| JESD-609 Code |
|
e0
|
| Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
|
|
|
Compare HCPL-J456500 with alternatives
Compare HCPL-J456300 with alternatives