HCPL-788J500
vs
IL614-3E
feature comparison
Part Life Cycle Code |
Transferred
|
Active
|
Ihs Manufacturer |
HEWLETT PACKARD CO
|
NVE CORP
|
Part Package Code |
SOIC
|
SOIC
|
Package Description |
,
|
SOP,
|
Pin Count |
16
|
16
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.33.00.01
|
8542.33.00.01
|
Amplifier Type |
ISOLATION AMPLIFIER
|
ISOLATION AMPLIFIER
|
Bandwidth (3dB)-Nom |
30 MHz
|
|
Isolation Voltage-Min |
3750 V
|
|
JESD-30 Code |
R-PDSO-G16
|
R-PDSO-G16
|
Number of Functions |
1
|
3
|
Number of Terminals |
16
|
16
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Supply Voltage Limit-Max |
5.5 V
|
7 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Position |
DUAL
|
DUAL
|
Voltage Gain-Max |
8.332
|
|
Voltage Gain-Min |
7.539
|
|
Base Number Matches |
3
|
1
|
Rohs Code |
|
Yes
|
Common Mode Voltage-Max |
|
400 V
|
Length |
|
9.9 mm
|
Package Code |
|
SOP
|
Package Equivalence Code |
|
SOP16,.25
|
Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
Seated Height-Max |
|
1.8 mm
|
Terminal Pitch |
|
1.27 mm
|
Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
Width |
|
3.9 mm
|
|
|
|
Compare HCPL-788J500 with alternatives
Compare IL614-3E with alternatives