HCPL-788J-500
vs
HCPL-788J500
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
BROADCOM INC
HEWLETT PACKARD CO
Package Description
SOP, SOP16,.4
,
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.33.00.01
8542.33.00.01
Amplifier Type
ISOLATION AMPLIFIER
ISOLATION AMPLIFIER
Bandwidth (3dB)-Nom
0.03 MHz
30 MHz
Isolation Voltage-Min
5000 V
3750 V
JESD-30 Code
R-PDSO-G16
R-PDSO-G16
Length
10.3 mm
Moisture Sensitivity Level
1
Number of Functions
1
1
Number of Terminals
16
16
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
Package Equivalence Code
SOP16,.4
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.911 mm
Supply Current-Max
20 mA
Supply Voltage Limit-Max
5.5 V
5.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
Terminal Position
DUAL
DUAL
Voltage Gain-Max
8.3333
8.332
Voltage Gain-Min
7.5397
7.539
Width
7.5 mm
Base Number Matches
2
3
Part Package Code
SOIC
Pin Count
16
Compare HCPL-788J-500 with alternatives
Compare HCPL-788J500 with alternatives