HCPL-7851
vs
HCPL7820#500
feature comparison
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
HEWLETT PACKARD CO
|
AVAGO TECHNOLOGIES INC
|
Part Package Code |
DIP
|
SOIC
|
Package Description |
,
|
SOP,
|
Pin Count |
8
|
8
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.33.00.01
|
8542.33.00.01
|
Amplifier Type |
ISOLATION AMPLIFIER
|
ISOLATION AMPLIFIER
|
Bandwidth (3dB)-Nom |
100 MHz
|
200 MHz
|
JESD-30 Code |
R-PDIP-T8
|
R-PDSO-G8
|
Number of Functions |
1
|
1
|
Number of Terminals |
8
|
8
|
Operating Temperature-Max |
125 °C
|
100 °C
|
Operating Temperature-Min |
-55 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
SMALL OUTLINE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Supply Voltage Limit-Max |
5.5 V
|
5.5 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
NO
|
YES
|
Temperature Grade |
MILITARY
|
INDUSTRIAL
|
Terminal Form |
THROUGH-HOLE
|
GULL WING
|
Terminal Position |
DUAL
|
DUAL
|
Voltage Gain-Max |
8.4
|
8.4
|
Voltage Gain-Min |
7.6
|
7.6
|
Base Number Matches |
4
|
4
|
Common Mode Voltage-Max |
|
3750 V
|
Isolation Voltage-Min |
|
3750 V
|
Length |
|
9.65 mm
|
Package Code |
|
SOP
|
Seated Height-Max |
|
4.19 mm
|
Technology |
|
CMOS
|
Terminal Pitch |
|
2.54 mm
|
Width |
|
6.35 mm
|
|
|
|
Compare HCPL-7851 with alternatives
Compare HCPL7820#500 with alternatives