HCPL-7800A-000E
vs
HCPL-7800B#500
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
AGILENT TECHNOLOGIES INC
HEWLETT PACKARD CO
Package Description
DIP-8
SOP,
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.33.00.01
8542.33.00.01
Amplifier Type
ISOLATION AMPLIFIER
ISOLATION AMPLIFIER
JESD-30 Code
R-PDIP-T8
R-PDSO-G8
Moisture Sensitivity Level
1
Number of Functions
1
1
Number of Terminals
8
8
Operating Temperature-Max
100 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
SOP
Package Equivalence Code
DIP8,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
SMALL OUTLINE
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Not Qualified
Supply Current-Max
16 mA
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
YES
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
THROUGH-HOLE
GULL WING
Terminal Pitch
2.54 mm
Terminal Position
DUAL
DUAL
Base Number Matches
3
4
Part Package Code
SOIC
Pin Count
8
Bandwidth (3dB)-Nom
85 MHz
Common Mode Voltage-Max
3750 V
Isolation Voltage-Min
3750 V
Supply Voltage Limit-Max
5.5 V
Technology
CMOS
Voltage Gain-Max
8.15
Voltage Gain-Min
7.99
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