HCPL-530K
vs
HCPL-5301#200
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
HEWLETT PACKARD CO
|
AVAGO TECHNOLOGIES INC
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
3A001.A.2.C
|
3A001.A.2.C
|
| HTS Code |
8541.40.80.00
|
8541.40.80.00
|
| Additional Feature |
HIGH RELIABILITY, MOS COMPATIBLE
|
HIGH RELIABILITY
|
| Configuration |
COMPLEX
|
SINGLE
|
| Forward Current-Max |
0.025 A
|
0.025 A
|
| Isolation Voltage-Max |
1500 V
|
1500 V
|
| JESD-609 Code |
e0
|
|
| Mounting Feature |
THROUGH HOLE MOUNT
|
SURFACE MOUNT
|
| Number of Elements |
1
|
1
|
| Number of Functions |
1
|
1
|
| On-State Current-Max |
0.015 A
|
0.015 A
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Optoelectronic Device Type |
LOGIC IC OUTPUT OPTOCOUPLER
|
LOGIC IC OUTPUT OPTOCOUPLER
|
| Power Dissipation-Max |
0.1 W
|
0.1 W
|
| Supply Voltage-Min |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom |
30 V
|
30 V
|
| Surface Mount |
NO
|
YES
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
| Base Number Matches |
4
|
1
|
| Pbfree Code |
|
Yes
|
| Package Description |
|
HERMETIC SEALED, DIP-8
|
| Samacsys Manufacturer |
|
Avago Technologies
|
|
|
|
Compare HCPL-530K with alternatives
Compare HCPL-5301#200 with alternatives