HCHP2208L1103GBPT131
vs
HCHP2208200PPM110K2%NE2
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
VISHAY INTERTECHNOLOGY INC
|
VISHAY INTERTECHNOLOGY INC
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| Construction |
Chip
|
Chip
|
| JESD-609 Code |
e0
|
e2
|
| Mounting Feature |
SURFACE MOUNT
|
SURFACE MOUNT
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
155 °C
|
155 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Height |
0.5 mm
|
0.5 mm
|
| Package Length |
5.58 mm
|
5.58 mm
|
| Package Style |
SMT
|
SMT
|
| Package Width |
1.91 mm
|
2 mm
|
| Packing Method |
Tape, Paper
|
Waffle Pack
|
| Rated Power Dissipation (P) |
0.75 W
|
0.75 W
|
| Reference Standard |
MIL-R-55342D
|
MIL-R-55342D
|
| Resistance |
110000 Ω
|
110000 Ω
|
| Resistor Type |
FIXED RESISTOR
|
FIXED RESISTOR
|
| Size Code |
2208
|
2208
|
| Surface Mount |
YES
|
YES
|
| Technology |
METAL GLAZE/THICK FILM
|
METAL GLAZE/THICK FILM
|
| Temperature Coefficient |
200 ppm/°C
|
200 ppm/°C
|
| Terminal Finish |
Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier
|
Tin/Silver (Sn/Ag) - with Nickel (Ni) barrier
|
| Terminal Shape |
WRAPAROUND
|
WRAPAROUND
|
| Tolerance |
2%
|
2%
|
| Working Voltage |
200 V
|
200 V
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare HCHP2208L1103GBPT131 with alternatives
Compare HCHP2208200PPM110K2%NE2 with alternatives