HCHP2010L1006JB151
vs
CHP2010L1006JN
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
VISHAY INTERTECHNOLOGY INC
|
VISHAY INTERTECHNOLOGY INC
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
|
| Construction |
Chip
|
Chip
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
155 °C
|
155 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Height |
0.5 mm
|
0.5 mm
|
| Package Length |
5.08 mm
|
5.03 mm
|
| Package Style |
SMT
|
SMT
|
| Package Width |
2.54 mm
|
2.64 mm
|
| Packing Method |
Waffle Pack
|
WAFFLE PACK
|
| Rated Power Dissipation (P) |
1 W
|
1 W
|
| Reference Standard |
MIL-R-55342D
|
MIL-R-55342D
|
| Resistance |
100000000 Ω
|
100000000 Ω
|
| Resistor Type |
FIXED RESISTOR
|
FIXED RESISTOR
|
| Size Code |
2010
|
2010
|
| Technology |
METAL GLAZE/THICK FILM
|
METAL GLAZE/THICK FILM
|
| Temperature Coefficient |
200 ppm/°C
|
200 ppm/°C
|
| Tolerance |
5%
|
5%
|
| Working Voltage |
200 V
|
200 V
|
| Base Number Matches |
1
|
4
|
| Package Description |
|
CHIP, HALOGEN FREE AND ROHS COMPLIANT
|
| JESD-609 Code |
|
e2
|
| Mounting Feature |
|
SURFACE MOUNT
|
| Package Shape |
|
RECTANGULAR PACKAGE
|
| Rated Temperature |
|
70 °C
|
| Surface Mount |
|
YES
|
| Terminal Finish |
|
TIN SILVER OVER NICKEL
|
| Terminal Shape |
|
WRAPAROUND
|
|
|
|
Compare HCHP2010L1006JB151 with alternatives
Compare CHP2010L1006JN with alternatives