HCHP0805100PPM178K0.5%BR0151
vs
CDP0805178K0.5%100PPM/KKS
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
VISHAY INTERTECHNOLOGY INC
|
MICROTECH GMBH ELECTRONIC
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| Construction |
Chip
|
Chip
|
| Mounting Feature |
SURFACE MOUNT
|
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
155 °C
|
155 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Height |
0.5 mm
|
0.5 mm
|
| Package Length |
1.91 mm
|
2 mm
|
| Package Style |
SMT
|
SMT
|
| Package Width |
1.27 mm
|
1.25 mm
|
| Packing Method |
Waffle Pack
|
Bulk
|
| Rated Power Dissipation (P) |
0.2 W
|
0.2 W
|
| Reference Standard |
MIL-R-55342D
|
|
| Resistance |
178000 Ω
|
178000 Ω
|
| Resistor Type |
FIXED RESISTOR
|
FIXED RESISTOR
|
| Size Code |
0805
|
0805
|
| Surface Mount |
YES
|
|
| Technology |
METAL GLAZE/THICK FILM
|
METAL GLAZE/THICK FILM
|
| Temperature Coefficient |
100 ppm/°C
|
100 ppm/°C
|
| Terminal Shape |
WRAPAROUND
|
|
| Tolerance |
0.5%
|
0.5%
|
| Working Voltage |
150 V
|
150 V
|
| Base Number Matches |
1
|
1
|
| JESD-609 Code |
|
e3
|
| Terminal Finish |
|
Tin (Sn) - with Nickel (Ni) barrier
|
|
|
|
Compare HCHP0805100PPM178K0.5%BR0151 with alternatives
Compare CDP0805178K0.5%100PPM/KKS with alternatives