HCHP0603L3900JB55
vs
RK73B1JTTED391J
feature comparison
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
VISHAY INTERTECHNOLOGY INC
|
KOA SPEER ELECTRONICS INC
|
Package Description |
CHIP
|
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8533.21.00.30
|
|
Additional Feature |
HIGH PRECISION
|
|
Construction |
Rectangular
|
Chip
|
Mounting Feature |
SURFACE MOUNT
|
|
Number of Terminals |
2
|
2
|
Operating Temperature-Max |
155 °C
|
155 °C
|
Operating Temperature-Min |
-55 °C
|
-55 °C
|
Package Height |
0.53 mm
|
0.45 mm
|
Package Length |
1.68 mm
|
1.6 mm
|
Package Style |
SMT
|
SMT
|
Package Width |
0.98 mm
|
0.8 mm
|
Packing Method |
WAFFLE PACK
|
Tape, Plastic
|
Rated Power Dissipation (P) |
0.1 W
|
0.1 W
|
Rated Temperature |
70 °C
|
|
Resistance |
390 Ω
|
390 Ω
|
Resistor Type |
FIXED RESISTOR
|
FIXED RESISTOR
|
Size Code |
0603
|
0603
|
Surface Mount |
YES
|
|
Technology |
METAL GLAZE/THICK FILM
|
METAL GLAZE/THICK FILM
|
Temperature Coefficient |
200 ppm/°C
|
200 ppm/°C
|
Terminal Finish |
Tin/Lead/Silver - with Nickel barrier
|
MATTE TIN OVER NICKEL
|
Terminal Shape |
WRAPAROUND
|
|
Tolerance |
5%
|
5%
|
Working Voltage |
50 V
|
50 V
|
Base Number Matches |
1
|
1
|
JESD-609 Code |
|
e3
|
Reference Standard |
|
MIL-R-55342F
|
|
|
|
Compare HCHP0603L3900JB55 with alternatives
Compare RK73B1JTTED391J with alternatives