HCHP0603K2874FB151
vs
RC1608F2874GS
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
VISHAY INTERTECHNOLOGY INC
|
SAMSUNG ELECTRO-MECHANICS
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| Construction |
Chip
|
Chip
|
| Mounting Feature |
SURFACE MOUNT
|
SURFACE MOUNT
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
155 °C
|
155 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Height |
0.5 mm
|
0.45 mm
|
| Package Length |
1.52 mm
|
1.6 mm
|
| Package Style |
SMT
|
SMT
|
| Package Width |
0.85 mm
|
0.8 mm
|
| Packing Method |
Waffle Pack
|
BULK
|
| Rated Power Dissipation (P) |
0.125 W
|
0.1 W
|
| Reference Standard |
MIL-R-55342D
|
|
| Resistance |
2870000 Ω
|
2870000 Ω
|
| Resistor Type |
FIXED RESISTOR
|
FIXED RESISTOR
|
| Size Code |
0603
|
0603
|
| Surface Mount |
YES
|
YES
|
| Technology |
METAL GLAZE/THICK FILM
|
METAL GLAZE/THICK FILM
|
| Temperature Coefficient |
100 ppm/°C
|
100 ppm/°C
|
| Terminal Finish |
Tin/Lead/Silver - with Nickel barrier
|
Matte Tin (Sn) - with Nickel (Ni) barrier
|
| Terminal Shape |
WRAPAROUND
|
WRAPAROUND
|
| Tolerance |
1%
|
1%
|
| Working Voltage |
50 V
|
50 V
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
Yes
|
| Package Description |
|
CHIP, ROHS COMPLIANT
|
| HTS Code |
|
8533.21.00.30
|
| Additional Feature |
|
PRECISION
|
| JESD-609 Code |
|
e3
|
| Package Shape |
|
RECTANGULAR PACKAGE
|
| Rated Temperature |
|
70 °C
|
|
|
|
Compare HCHP0603K2874FB151 with alternatives
Compare RC1608F2874GS with alternatives