HCF4511BEY vs MC74LCX139MEL feature comparison

HCF4511BEY STMicroelectronics

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MC74LCX139MEL onsemi

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer STMICROELECTRONICS ON SEMICONDUCTOR
Part Package Code DIP SOIC
Package Description PLASTIC, DIP-16 SOP, SOP16,.3
Pin Count 16 16
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer STMicroelectronics
Additional Feature BLANKING INPUT; LAMP TEST INPUT; LED DISPLAY DRIVER
Family 4000/14000/40000 LVC/LCX/Z
Input Conditioning LATCHED STANDARD
JESD-30 Code R-PDIP-T16 R-PDSO-G16
JESD-609 Code e3 e4
Load Capacitance (CL) 50 pF
Logic IC Type SEVEN SEGMENT DECODER/DRIVER 2-LINE TO 4-LINE DECODER
Number of Functions 1 2
Number of Terminals 16 16
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Output Polarity TRUE INVERTED
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Propagation Delay (tpd) 1320 ns 9.3 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.1 mm 2.05 mm
Supply Voltage-Max (Vsup) 20 V 3.6 V
Supply Voltage-Min (Vsup) 3 V 2 V
Supply Voltage-Nom (Vsup) 5 V 2.7 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish MATTE TIN NICKEL PALLADIUM GOLD
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Width 7.62 mm 5.275 mm
Base Number Matches 1 2
Length 10.2 mm
Max I(ol) 0.024 A
Moisture Sensitivity Level 3
Package Equivalence Code SOP16,.3
Packing Method TR
Peak Reflow Temperature (Cel) 260
Power Supply Current-Max (ICC) 0.01 mA
Prop. Delay@Nom-Sup 6.2 ns

Compare HCF4511BEY with alternatives

Compare MC74LCX139MEL with alternatives