HCF4056BM1
vs
CD54HC237F
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
STMICROELECTRONICS
|
HARRIS SEMICONDUCTOR
|
| Part Package Code |
SOIC
|
|
| Package Description |
SOP,
|
DIP, DIP16,.3
|
| Pin Count |
16
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
LCD DISPLAY DRIVER
|
ADDRESS LATCHES
|
| Family |
4000/14000/40000
|
HC/UH
|
| Input Conditioning |
LATCHED
|
LATCHED
|
| JESD-30 Code |
R-PDSO-G16
|
R-GDIP-T16
|
| JESD-609 Code |
e4
|
e0
|
| Length |
9.9 mm
|
|
| Load Capacitance (CL) |
50 pF
|
50 pF
|
| Logic IC Type |
SEVEN SEGMENT DECODER/DRIVER
|
3-LINE TO 8-LINE DECODER
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Output Polarity |
CONFIGURABLE
|
TRUE
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, GLASS-SEALED
|
| Package Code |
SOP
|
DIP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
IN-LINE
|
| Propagation Delay (tpd) |
1300 ns
|
240 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.75 mm
|
|
| Supply Voltage-Max (Vsup) |
20 V
|
6 V
|
| Supply Voltage-Min (Vsup) |
3 V
|
2 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
4.5 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
TIN LEAD
|
| Terminal Form |
GULL WING
|
THROUGH-HOLE
|
| Terminal Pitch |
1.27 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
3.9 mm
|
|
| Base Number Matches |
1
|
3
|
| Max I(ol) |
|
0.004 A
|
| Package Equivalence Code |
|
DIP16,.3
|
| Prop. Delay@Nom-Sup |
|
48 ns
|
|
|
|
Compare HCF4056BM1 with alternatives
Compare CD54HC237F with alternatives