HCF4050BM1
vs
CD4010BDMSH
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
STMICROELECTRONICS
HARRIS SEMICONDUCTOR
Part Package Code
SOIC
Package Description
SOP, SOP16,.25
DIP, DIP16,.3
Pin Count
16
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Samacsys Manufacturer
STMicroelectronics
Additional Feature
HIGH TO LOW LEVEL TRANSLATOR
RADIATION HARDENED; WITH EXTENDED INPUT VOLTAGE; IOL = 2.1MA @ VOL = 0.4V; IOH = 0.58MA @ VOH = 2.5V
Family
4000/14000/40000
4000/14000/40000
JESD-30 Code
R-PDSO-G16
R-CDIP-T16
JESD-609 Code
e4
e0
Length
9.9 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
BUFFER
BUFFER
Moisture Sensitivity Level
3
Number of Functions
6
6
Number of Inputs
1
1
Number of Terminals
16
16
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Body Material
PLASTIC/EPOXY
CERAMIC, METAL-SEALED COFIRED
Package Code
SOP
DIP
Package Equivalence Code
SOP16,.25
DIP16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
IN-LINE
Packing Method
TUBE
Prop. Delay@Nom-Sup
140 ns
270 ns
Propagation Delay (tpd)
140 ns
175 ns
Qualification Status
Not Qualified
Not Qualified
Schmitt Trigger
NO
NO
Seated Height-Max
1.75 mm
Supply Voltage-Max (Vsup)
20 V
18 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
NICKEL PALLADIUM GOLD
Tin/Lead (Sn/Pb)
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Pitch
1.27 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
3.9 mm
Base Number Matches
1
1
Max I(ol)
0.00035999999999999997 A
Screening Level
38535V;38534K;883S
Total Dose
1M Rad(Si) V
Compare HCF4050BM1 with alternatives
Compare CD4010BDMSH with alternatives