HCF4050BE vs NLV14050BDG feature comparison

HCF4050BE STMicroelectronics

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NLV14050BDG onsemi

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Rohs Code No
Part Life Cycle Code Obsolete End Of Life
Ihs Manufacturer STMICROELECTRONICS ONSEMI
Package Description DIP-16 SOIC-16
Reach Compliance Code not_compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature LG-MAX
Family 4000/14000/40000 4000/14000/40000
JESD-30 Code R-PDIP-T16 R-PDSO-G16
JESD-609 Code e0 e3
Length 20 mm 9.9 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type BUFFER BUFFER
Number of Functions 6 6
Number of Inputs 1 1
Number of Terminals 16 16
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP SOP
Package Equivalence Code DIP16,.3 SOP16,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Prop. Delay@Nom-Sup 140 ns 140 ns
Propagation Delay (tpd) 140 ns 140 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO NO
Seated Height-Max 5.1 mm 1.75 mm
Supply Voltage-Max (Vsup) 15 V 18 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Finish TIN LEAD MATTE TIN
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Width 7.62 mm 3.9 mm
Base Number Matches 2 1
Pbfree Code Yes
Part Package Code SOIC 16 LEAD
Pin Count 16
Manufacturer Package Code 751B-05
Samacsys Manufacturer onsemi
Moisture Sensitivity Level 1
Packing Method RAIL
Peak Reflow Temperature (Cel) 260
Screening Level AEC-Q100
Time@Peak Reflow Temperature-Max (s) 30

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Compare NLV14050BDG with alternatives