HCF4046BEY vs HEF4046BDF feature comparison

HCF4046BEY STMicroelectronics

Buy Now Datasheet

HEF4046BDF NXP Semiconductors

Buy Now Datasheet
Rohs Code Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer STMICROELECTRONICS NXP SEMICONDUCTORS
Part Package Code DIP
Package Description DIP, DIP16,.3 DIP,
Pin Count 16
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer STMicroelectronics
Analog IC - Other Type PHASE LOCKED LOOP PHASE LOCKED LOOP
JESD-30 Code R-PDIP-T16 R-GDIP-T16
JESD-609 Code e3
Number of Functions 1 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.1 mm 5.08 mm
Supply Voltage-Max (Vsup) 20 V 15 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO NO
Technology CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish MATTE TIN
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 1 1

Compare HCF4046BEY with alternatives

Compare HEF4046BDF with alternatives